MediaTek said on Dec. 26 it is working with Japanese automotive supplier DENSO to develop a custom automotive system-on-chip designed for advanced driver-assistance systems (ADAS) and in-vehicle cockpit applications, as semiconductor companies seek a larger role in the rapidly evolving automotive technology market.
The collaboration brings together DENSO’s experience in automotive safety engineering and vehicle integration with MediaTek’s power-efficient, high-performance chip technologies developed through its Dimensity AX platform. The companies aim to deliver a scalable and production-ready solution for global automakers and Tier-1 suppliers.
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MediaTek said the custom chip is being designed to comply with ISO 26262 functional safety standards, supporting ASIL-B and ASIL-D levels, and to meet AEC-Q100 automotive qualification requirements. The platform is also expected to support automotive software and system standards, including AUTOSAR and established in-vehicle networking protocols.
The system-on-chip will incorporate heterogeneous computing capabilities, including dedicated AI and neural processing units and advanced image signal processing. MediaTek said the architecture will support multi-sensor fusion across cameras, radar and lidar, enabling improved perception and decision-making in driver-assistance applications.
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To accelerate development and deployment, the joint solution will use pre-validated automotive-grade intellectual property, safety work products and reference designs. MediaTek said this approach is intended to improve system design quality while reducing time to market for vehicle manufacturers.
The company said the partnership with DENSO underscores its strategy to expand its automotive semiconductor portfolio, as demand grows for advanced computing platforms to support assisted driving and intelligent mobility solutions across global markets.
Source: PR Newswire